MicroFabrication Laboratory

Laboratory Use

The Microfabrication Laboratory offers the following processes on 100mm (4") diameter silicon wafers. Some processes can run 150 mm (6") wafers and 200 mm (8") wafers. If you have specific questions, please contact us.

Customer-supplied wafers must be CMOS-compatible.

For processing glass or pyrex, please contact us.

Thin Film Deposition

Chemical Vapor Deposition Furnaces

Silicon Nitride
Stoichiometric and Low-Stress
Polysilicon
In Situ Phosphorus-Doped Polysilicon
Low Temperature Oxide (LTO)
Phosphosilicate glass (PSG)
Wet and Dry Thermal Oxidation
Annealing
Sintering
Solid Source Boron Diffusion
Doped drive in

Plasma Enhanced Chemical Vapor Deposition

Low-stress silicon nitride

Silicon dioxide

Physical Vapor Deposition

Magnetron Sputtering (4", 6", and 8" wafers)
Al, Al, Si, Cu, Ni, Ti, W, Cr, NiCr (80/20, 50/50), ITO, Ta, Pd, Pt, Re, and more

Photolithography

800 nm resolution contact aligner
Front to backside alignment (IR)

Etch

Reactive ion etch (RIE) of polysilicon, silicon nitride, silicon dioxide, silicon carbide, diamond
Wet etch of silicon dioxide and Al
Anisotropic silicon etching

Metrology

Film thickness
Ellipsometry
Film Stress (25-500 °C)
Profilometry
4-Point Probe
Optical Fluorescence Microscope
Inspection Microscope (WWW linked)

Wafer Bonding

To become a certified user of the MFL, one must undergo chemical safety training, MFL safety testing, and individual training on each tool. To learn more about becoming a certified user please contact an staff member.

After an MFL safety tour, new users are required to pass a safety test. Below are the relevant documents for passing the safety test.
MFL Orientation Packet (Word Doc)
MFL Chemical Hygiene Plan (Word Doc)
MFL Safety Map (Jpeg Image)
MFL Entry & Exit Procedures (PDF)

Please contact an MFL staff member for current rate information.