case western reserve university

MicroFabrication Laboratory


Laboratory Use


The Microfabrication Laboratory offers the following processes on 100mm (4") diameter silicon wafers. Some processes can run 150 mm (6") wafers and 200 mm (8") wafers. If you have specific questions, please contact us.

Thin Film Deposition:

--Chemical Vapor Deposition Furnaces

Stoichiometric and Low-Stress Silicon Nitride
In Situ Phosphorus-Doped Polysilicon
Low Temperature Oxide (LTO)
Phosphosilicate glass (PSG)
Wet and Dry Thermal Oxidation
Solid Source Boron Diffusion
Doped drive in

--Plasma Enhanced Chemical Vapor Deposition

Silicon nitride
Silicon dioxide

--Physical Vapor Deposition

Magnetron Sputtering (4", 6", and 8" wafers)
Al, Si, Cu, Ni, Ti, W, Cr, NiCr (80/20, 50/50), ITO, Ta, Pd, Pt, Re, and more


800 nm resolution contact aligner
Front to backside alignment (IR)


Reactive ion etch (RIE) of polysilicon, silicon nitride, silicon dioxide, silicon carbide
Wet etch of silicon, silicon dioxide, Aluminum and Nickel
Deep-RIE of silicon


Film thickness
Film Stress (25-500 °C)
Optical Fluorescence Microscope
Inspection Microscope

Wafer Bonding


New Users

To become a certified user of the MFL, one must undergo chemical safety training, MFL safety testing, and individual training on each tool. To learn more about becoming a certified user please contact our staff members.


User Documents

After an MFL safety tour, new users are required to pass a safety test. Below are the relevant documents for passing the safety test.
MFL Orientation Packet (PDF)
MFL Chemical Hygiene Plan (PDF)
Lab Safety Manual (PDF)
MFL Safety Map (Jpeg Image)
MFL Entry & Exit Procedures (PDF)